Potting and Encapsulating Materials for Electronics

Engineering Materials - Selection Guide
General Purpose - Engineering Standard Silicone Potting and Encapsulation for Electronics

NuSil ID	Cure System	Work Time	Mix Ratio	Comments
R-2165	Platinum	10 M	1:1	Enhanced thermal conductivity for removal of heat and improved reliability
R-2175	Platinum	1 H	1:1	Thermally conductive silicone potting elastomer cures at room temperature
R-2188	Platinum	8 HR +	1:1	Pourable and self-leveling Cures at lower temperatures (≥70°C)
R-2613		2 HR	10:1	Pourable and self-leveling Cures at room temperature